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©1994-2009ChinaAcademicJournalElectronicPublishingHouse.Allrightsreserved.(1.,116026;2.,116012)LIANGCheng2hao1,2,YUXiang2fei2(1.Electromechanics&MaterialsEngineeringCollege,DalianMaritimeUniversity,Dalian116026,China;2.SchoolofChemicalEngineering,DalianUniversityofTechnology,Dalian116012,China):,,:;;Abstract:ThepresentprocessesforimitationgoldplatingofCu2Znalloyarereviewed,andtheformulasforcyanideandnon2cyanideimitationgoldplatingtechniquesaresystematicallysummarized.Especially,thebathcompositions,technologicalprocessandpost2treatmentfornon2cyanideimitationgoldplatingareanalyzedandcompared.Finally,thedevelopmenttrendofimitationgoldplatingprocessesisprospected.Keywords:imitationgoldplating;process;developmentprospect:TQ153.2:A:100024742(2008)04200012040,,,;,18K24K,,[1],Cu2ZnCu+,,,,,[2],,,11841[3],,,24K,,,,1.1[426][7][5],11/(gL-1)1[4][7][5]22.515183525.5791.52.564.514181.52.530301533.80.0050.510.31131525460.051518pH11.5128.99.5/153020352535Jk/(Adm-2)0.51.00.30.50.51.5120087284(162)©1994-2009ChinaAcademicJournalElectronicPublishingHouse.Allrightsreserved.[3]2,0.2moL/L,Zn2+;Cu2+2:,100%,pH,80%100%1.2A/dm2,,,2,2[8]22[9]/(gL-1)22CuSO45H2O2512.5ZnSO47H2O30302012NaOH120120/()20222022Jk/(Adm-2)0.21.50.91.5JA/(Adm-2)0.50.80.50.81.2.2Cu2+Zn2+,[Cu(P2O7)2]6-[Zn(P2O7)2]6-,1.010-91.010-11Cu2+,,,,,,,;,,,,[8],3[10214]3/(gL-1)3Cu2P2O71416CuSO45H2O40451545ZnSO47H2O1217415SnCl22H2O45455K4P2O73H2O270300360320N(CH2COOH)320302525NaKC4H4O64H2O4035NaH2PO412H2O35K3C6H5O72030KOH1520701520pH8.59.08.78.89.3/204010202025Jk/(Adm-2)0.32.00.71.251.11.41.2.3Cu2ZnCu2+Zn2+,,300mV,:,,,[15]:2530g/L1525g/L4050g/L2540mL/L1525g/LpH891530Jk2.04.0A/dm21.2.4,Cu2+Zn2+,2July2008Electroplating&PollutionControlVol.28No.4©1994-2009ChinaAcademicJournalElectronicPublishingHouse.Allrightsreserved.[Zn(OH)C4H4O6]-;pH11,[Zn(OH)4]2-2.410-83.610-16pH10,Cu2+[Cu(OH)2C4H4O6]2-,7.310-20Cu2+Zn2+[6],,,,,38A/dm24,4/(gL-1)4[3][16]CuSO45H2O3030ZnSO47H2O1214KNaC4H4O64H2O10090NaOH505014720pH12.412.4/4040Jk/(Adm-2)461.2.5HEDPHEDPCu2+Zn2+,,18K22K5HEDP[17219]5/(gL-1),,,,,,,,5HEDP45504550152028152010HEDP801008010013010151020306040(SC)1212NH4F1.00.50.52030pH1313.513.013.5133540Jk/(Adm-2)1.53.51.53.51.5,,[20],,2,,;,,2.1[7]()()2.2,,,(),,[6]:320087284(162)©1994-2009ChinaAcademicJournalElectronicPublishingHouse.Allrightsreserved.(1)410g/LB29B20mL/L3040t1520minpH34(2)(BTA)12g/Lt4560s(3)[21]140.13%,,pH,;pH,pH,BTA,BTACu2+,,Cu2+BTA,,,,3,,,,,Cu2ZnCu2Zn2Sn,[22],,,,,,:[1].[J].,1987,9(1):18222.[2].[J].,2003,23(4):10211.[3].[M].:,1993.[4]Abbott,CharlesN.Zinc2copperalloyelectroplatingbaths:US,3930965[P].1976206201.[5]EdwardPaulHarbulak,RonaldJosephLash.Brassplating:GB1526660[P].1978209227.[6].[M].:,2007.[7],.[M].:,2007.[8],.[M]..:,1989.[9],.[J].,2006,25(3):51254.[10].[J].,2003(3):33235.[11]Ameen,ThomasJ.Non2cyanidebrassplatingbathandamethodofmakingmetallicfoilhavingabrasslayerusingthenon2cyanidebrassplatingbath:US,5762778[P].1998206209.[12],,.[J].,2001,23(2):1762178.[13],,.ABS[J].(),2002(4):2892291.[14].ABS[J].,1998,10(3):16218.[15]HiguchiYukinobu,OgaYomoyo,MizuguchiShunichi,etal.Corrosion2resistantcoatingonsteels:,612003886A[P].1986201219.[16],,,.[J].,2004,23(1):12215.[17]KrishmanRM,MuraliaharanVS,NataraianSR.Non2cyanidebrasselectroplatingbath[J].BulletinofElectrochemistry,1996,12(526):274.[18],.[J].,1986,8(5):10.[19],,.:,86105831[P].1986202224.[20],,.[J].,2003,10(3):13214.[21],,,.[J].,2003,22(3):39241.[22],,.[J].,1999,21(3):16219.:20072122214July2008Electroplating&PollutionControlVol.28No.4